Product functions:

1. Paint can be removed or painted. It is better to use with hot air nozzle and scraper.

2. Remove self-adhesive stickers and decorations.

3. Remove rusty or too tight nuts and metal screws.

4. Dissolve frozen conveying pipes, frozen door locks or padlocks, etc. (do not try to use them on plastic pipes).

5. Soften the oil before treating the oil stain or replacing the old grinding powder.

6. Dry the damp wood before assembly or processing.

7. Shrinkable PVC film is used as the protective layer of the package.

8. It can be used for waxing or dewaxing of sleigh.

9. Polyethylene for shrinkable connection metal.

10. Soften the weldment.

usage method:

The correct use of the hot-air gun can improve the maintenance efficiency. If it is not used properly, the mobile phone motherboard will be damaged. For example, when some maintenance personnel remove the power amplifier or CPU, they find that the circuit board of the mobile phone has dropped solder joints, the plastic cable base and the keyboard base have been damaged, and even there is a short circuit. This is actually caused by the fact that the maintenance personnel do not understand the characteristics of the hot-air gun. Therefore, how to use the hot-air gun correctly is the key to the maintenance of mobile phones.

1. Method of blow welding small patch elements

Small chip components in mobile phones mainly include chip resistors, chip capacitors, chip inductors and chip transistors. For these small components, a hot-air gun is generally used for blow welding. When blowing welding, you must master the air volume, wind speed and direction of air flow. Improper operation will not only blow away small components, but also damage large components.

The small nozzle nozzle is generally used for blowing and welding small patch elements. The temperature of the hot-air gun is adjusted to 2-3 gears and the wind speed is adjusted to 1-2 gears. After the temperature and air flow are stable, the small patch element can be clamped with finger pliers, so that the nozzle of the hot-air gun is 2 ~ 3cm away from the element to be disassembled and kept vertical. Heat the element evenly in the upper direction. After the solder around the element is melted, remove it with finger pliers. If small components are to be welded, the components should be placed correctly. If there is insufficient tin on the solder joint, a soldering iron can be used to fill an appropriate amount of solder on the solder joint. The welding method is the same as the disassembly method, as long as the temperature and air flow direction are paid attention to.

2. Method of blow soldering chip integrated circuit

When blowing and soldering chip integrated circuits with a hot-air gun, first apply an appropriate amount of flux on the surface of the chip, which can not only prevent dry blowing, but also help the solder joints at the bottom of the chip to melt evenly. Due to the relatively large volume of the SMD integrated circuit, large nozzle can be used for blowing and soldering. The temperature of the hot-air gun can be adjusted to 3-4 gears, and the air volume can be adjusted to 2-3 gears. The nozzle of the air gun should be about 2.5cm away from the chip. During blow soldering, heat evenly above the chip until the solder beads at the bottom of the chip are completely melted. At this time, use finger pliers to remove the whole chip. It should be noted that when blowing and soldering such chips, attention must be paid to whether they affect peripheral components. In addition, after the chip is removed, there will be residual tin on the circuit board of the mobile phone, which can be removed with a soldering iron. If the chip is welded, the chip shall be aligned with the corresponding position of the circuit board. The welding method is the same as the disassembly method.

3. Product power: 1500W 1600W 1800W 2000W